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The copper electroplating process you are controlling using the ISE requires the

ID: 998250 • Letter: T

Question

The copper electroplating process you are controlling using the ISE requires the plating solution to be 4.0 plusminus 0.1 M in Cu(II). The copper indicator electrode experiment is as diagrammed in the figure below. What is the highest and the lowest potential you expect to measure in the system described if the solution concentration is within the specified limits (4.0 plusminus 0.1 M)? You may assume that the junction potential is zero. Lowest: 0.356V Highest: 0.357V Lowest: 0.135V Highest: 0.136V Lowest: 0.131V Highest: 0.136V Lowest: 0.339V Highest: 0.357V

Explanation / Answer

Ffor the given electrochemical cell, the maximum and minimum potential that can be measured by using the cell setup described below would be,

Lowest : 0.339 V and highest : 0.357 V

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The copper complex, Cu(NHs)SO, prepared earlier in the semester will be analyzed
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The copper sulfate hydrate that you will use in this experiment is sometimes kno