Please answer this questions and show all work and all steps and be thoroughly c
ID: 2269275 • Letter: P
Question
Please answer this questions and show all work and all steps and be thoroughly clear with each step .
n article in Solid State Technology, "Orthogonal Design for Process Optimization and n caton to Plasma Etching" by G. Z. Yin and D. w Jillic (May 1987) describesn the periment to determine the effect of the CaFo flow rate (in surface cubic unformity of the etch on the silicon wafer used in integrated circuit manufacturing flow rates are as follows: Data for tweo CFs Flow ETCH UNIFORMITY OBSERVED (SCCM) 1 6 7 125 SCCM 2.7 3.3 2.6 3.0 3.2 3.5 2.9 200 SCCM 2.9 3.7 3.4 5.1 4.6 4.9 4.6 Setup the hypothesis to test if there is a difference in mean etch uniformity at different flow rates b) Use the Tukey's quick test to determine if flow rate affects etch uniformity c) If flow rate affects etch uniformity in 2b) determine the confidence level associated with your conclusion d) Provide an exhaustive interpretation of your resultsExplanation / Answer
a)
H0: The diffrence in mean value at different flow rates=0
H1:The diffrence in mean value at different flow rates is not 0
b)
At alpha=0.05 if T is larger than 6 reject null hypothesis
Given
The minimum value=2.6 and maximum value =5.1 hence denote the grups as S and L where the values occur
Ts =2
Tl=5
T=Ts+ Tl=2+5=7
As T=7>6
We reject H0
c)
The confidence level is 1-alpha=1-0.05 = 0.95 or 95% confidence
d)
As we reject the null hypothesis H0 we conclude that "The diffrence in mean value at different flow rates is not 0"
ie there is a significant difference in the mean value at the different flow rates
1 2 3 4 5 6 7 125 2.7 3.3 2.6 3 3.2 3.5 2.9 S 200 2.9 3.7 3.4 5.1 4.6 4.9 4.6 L